Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	HSB11-252518 CUI Devices Price: - RFQ	HSB11-252518 CUI Devices	HEAT SINK, BGA, 25 X 25 X 18 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB06-181810 CUI Devices Price: - RFQ	HSB06-181810 CUI Devices	HEAT SINK, BGA, 18 X 18 X 10 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB19-272718 CUI Devices Price: - RFQ	HSB19-272718 CUI Devices	HEAT SINK, BGA, 27 X 27 X 18 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB24-252510 CUI Devices Price: - RFQ	HSB24-252510 CUI Devices	HEAT SINK, BGA,25 X 25 X 10 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB27-434316 CUI Devices Price: - RFQ	HSB27-434316 CUI Devices	HEAT SINK, BGA, 43.1 X 43.1 X 16	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-03 CUI Devices Price: - RFQ	HSC-03 CUI Devices	HEAT SINK CLIP FOR HSE-B20350-NP	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-04 CUI Devices Price: - RFQ	HSC-04 CUI Devices	HEAT SINK CLIP FOR HSE-B20X AND	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-C52-NP-SMT-TR CUI Devices Price: - RFQ	HSS-C52-NP-SMT-TR CUI Devices	HEAT SINK TO-252 COPPER	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS03-B20-P318 CUI Devices Price: - RFQ	HSS03-B20-P318 CUI Devices	HEAT SINK, STAMPING, TO-220, 41.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS04-B20-P318 CUI Devices Price: - RFQ	HSS04-B20-P318 CUI Devices	HEAT SINK, STAMPING, TO-220, 41.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: