CUI Devices HSB27-434316

Manufacturer Part #:

HSB27-434316

Manufacturer:

CUI Devices

Package/Case:

Datasheet:

Description:

HEAT SINK, BGA, 43.1 X 43.1 X 16

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Specifications

Type	Description
Category	Heat Sinks
Manufacturer	CUI Devices
Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.650" (16.51mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	2.80°C/W @ 200 LFM
Length	1.697" (43.10mm)
Thermal Resistance @ Natural	8.35°C/W
Mfr	CUI Devices
Material Finish	Black Anodized
Package	Box
Attachment Method	Adhesive
Width	1.697" (43.10mm)
Diameter	-
Power Dissipation @ Temperature Rise	8.98W @ 75°C
Package Cooled	BGA