HSB27-434316

CUI Devices

Manufacturer Part #:

HSB27-434316

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 43.1 X 43.1 X 16

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Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	1.697" (43.10mm)
Length	1.697" (43.10mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.650" (16.51mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	8.35°C/W
Power Dissipation @ Temperature Rise	8.98W @ 75°C
Thermal Resistance @ Forced Air Flow	2.80°C/W @ 200 LFM

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