HSS-C52-NP-SMT-TR

CUI Devices

Manufacturer Part #:

HSS-C52-NP-SMT-TR

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK TO-252 COPPER

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Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Rectangular, Fins
Width	0.900" (22.86mm)
Length	0.315" (8.00mm)
Series	HSS
Package	Tape & Reel (TR)
Diameter	-
Material	Copper
Fin Height	0.400" (10.16mm)
Package Cooled	TO-252 (DPak)
Product Status	Active
Material Finish	Tin
Attachment Method	-
Base Product Number	HSS-C52
Thermal Resistance @ Natural	35.71°C/W
Power Dissipation @ Temperature Rise	2.1W @ 75°C
Thermal Resistance @ Forced Air Flow	10.05°C/W @ 200 LFM

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