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HSB19-272718

CUI Devices

Manufacturer Part #:

HSB19-272718

Manufacturer:

CUI Devices

Package:

Date Code:

Lead Time:

10 Weeks

Datasheet:

Description:

HEAT SINK, BGA, 27 X 27 X 18 MM

Quantity:

In Stock : Please inquire

Please send an RFQ, and we will respond immediately.

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Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	1.063" (27.00mm)
Length	1.063" (27.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.709" (18.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	11.11°C/W
Power Dissipation @ Temperature Rise	6.8W @ 75°C
Thermal Resistance @ Forced Air Flow	4.50°C/W @ 200 LFM

User Guide

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer.

Request for Quotations

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.