HSS26-B20-P38

CUI Devices

Manufacturer Part #:

HSS26-B20-P38

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218/TO-2

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Specifications

Product Details

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Fins
Width	1.378" (35.00mm)
Length	2.000" (50.80mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum Alloy
Fin Height	0.335" (8.50mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Thermal Resistance @ Natural	16.66°C/W
Power Dissipation @ Temperature Rise	4.5W @ 75°C
Thermal Resistance @ Forced Air Flow	9.20°C/W @ 200 LFM

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