CUI Devices HSB18-232310

Manufacturer Part #:

HSB18-232310

Manufacturer:

CUI Devices

Package/Case:

Datasheet:

Description:

HEAT SINK, BGA, 23 X 23 X 10 MM

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Specifications

Type	Description
Category	Heat Sinks
Manufacturer	CUI Devices
Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.394" (10.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	6.80°C/W @ 200 LFM
Length	0.906" (23.00mm)
Thermal Resistance @ Natural	20.41°C/W
Mfr	CUI Devices
Material Finish	Black Anodized
Package	Box
Attachment Method	Adhesive
Width	0.906" (23.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	3.7W @ 75°C
Package Cooled	BGA