CUI Devices HSS08-B18-CP

Manufacturer Part #:

HSS08-B18-CP

Manufacturer:

CUI Devices

Package/Case:

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218, 44.

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Specifications

Type	Description
Category	Heat Sinks
Manufacturer	CUI Devices
Shape	Square
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.492" (12.50mm)
Series	HSS
Type	Board Level, Vertical
Thermal Resistance @ Forced Air Flow	3.50°C/W @ 200 LFM
Length	1.750" (44.45mm)
Thermal Resistance @ Natural	7.29°C/W
Mfr	CUI Devices
Material Finish	Black Anodized
Package	Box
Attachment Method	PC Pin
Width	1.750" (44.45mm)
Diameter	-
Power Dissipation @ Temperature Rise	10.3W @ 75°C
Package Cooled	TO-218