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HSS07-C20-P274

CUI Devices

Manufacturer Part #:

HSS07-C20-P274

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 21.

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Specifications

Product Details

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular
Width	0.520" (13.21mm)
Length	0.853" (21.66mm)
Series	HSS
Package	Box
Diameter	-
Material	Copper Alloy
Fin Height	0.515" (13.08mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Tin
Attachment Method	PC Pin
Thermal Resistance @ Natural	29.57°C/W
Power Dissipation @ Temperature Rise	2.5W @ 75°C
Thermal Resistance @ Forced Air Flow	12.60°C/W @ 200 LFM

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.