HSS02-B20-P318

CUI Devices

Manufacturer Part #:

HSS02-B20-P318

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 23.

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Specifications

Product Details

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular
Width	0.930" (23.62mm)
Length	1.900" (48.26mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.950" (24.13mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Thermal Resistance @ Natural	10.90°C/W
Power Dissipation @ Temperature Rise	6.9W @ 75°C
Thermal Resistance @ Forced Air Flow	4.80°C/W @ 200 LFM

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