HSE08-505028

CUI Devices

Manufacturer Part #:

HSE08-505028

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218/TO-

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Specifications

Product Details

Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Angled Fins
Width	1.102" (28.00mm)
Length	1.969" (50.00mm)
Series	HSE
Package	Bag
Diameter	-
Material	Aluminum Alloy
Fin Height	1.969" (50.00mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Clip
Thermal Resistance @ Natural	7.13°C/W
Power Dissipation @ Temperature Rise	10.53W @ 75°C
Thermal Resistance @ Forced Air Flow	2.70°C/W @ 200 LFM

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