HSE-B18635-060H-W

CUI Devices

Manufacturer Part #:

HSE-B18635-060H-W

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218, 63

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Specifications

Product Details

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Angled Fins
Width	1.638" (41.60mm)
Length	2.500" (63.50mm)
Series	HSE
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.984" (25.00mm)
Package Cooled	TO-218
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Base Product Number	HSE-B18635
Thermal Resistance @ Natural	4.49°C/W
Power Dissipation @ Temperature Rise	16.7W @ 75°C
Thermal Resistance @ Forced Air Flow	2.24°C/W @ 200 LFM

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