HSB23-232325

CUI Devices

Manufacturer Part #:

HSB23-232325

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 23 X 23 X 25 MM

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Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.906" (23.00mm)
Length	0.906" (23.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.984" (25.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	12.23°C/W
Power Dissipation @ Temperature Rise	6.13W @ 75°C
Thermal Resistance @ Forced Air Flow	3.80°C/W @ 200 LFM

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