HSB22-606010

CUI Devices

Manufacturer Part #:

HSB22-606010

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 60 X 60 X 10 MM

Send an RFQ

For any specific requests regarding price, qty, ect. please send an RFQ.

Contact Name

Company Name

Country

Quantity

Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	2.362" (60.00mm)
Length	2.362" (60.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum
Fin Height	0.394" (10.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	7.62°C/W
Power Dissipation @ Temperature Rise	9.8W @ 75°C
Thermal Resistance @ Forced Air Flow	2.60°C/W @ 200 LFM

Shopping Guide

Payment Methods

For your convenience, we support multiple payment methods, including PayPal, credit cards, and bank transfers, all payments are settled in USD.

RFQ (Request for Quotations)

1. For products with available stock and price, you can directly place an order.
2. For products without stock or price displayed, please submit an RFQ, and we will respond within 24 hours.

Supply Information

SemiKey Stock: Inventory purchased directly from original manufacturers, authorized distributors, or OEM/EMS.

Authorized Distributor: Channels from the original manufacturer or their authorized distributors.
OEM & EMS: Excess inventory from OEM and EMS providers.

About Shipping Costs

If you choose to use our shipping account, the shipping cost must be paid when placing the order. If you choose to use your own shipping account, the cost will depend on the agreement between you and the shipping company.

Please note: Customers are responsible for all fees charged by the destination government or customs, including but not limited to duties, taxes, and any additional fees charged by the courier company. SemiKey is not responsible for any extra charges once the package has been shipped.