HSB13-303014

CUI Devices

Manufacturer Part #:

HSB13-303014

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 30.7 X 30.7 X 14

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Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	1.209" (30.70mm)
Length	1.209" (30.70mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.551" (14.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	12.36°C/W
Power Dissipation @ Temperature Rise	6.1W @ 75°C
Thermal Resistance @ Forced Air Flow	4.70°C/W @ 200 LFM

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