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HSB08-212106

CUI Devices

Manufacturer Part #:

HSB08-212106

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 21 X 21 X 6 MM

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Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.827" (21.00mm)
Length	0.827" (21.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.236" (6.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	25.40°C/W
Power Dissipation @ Temperature Rise	3.0W @ 75°C
Thermal Resistance @ Forced Air Flow	9.70°C/W @ 200 LFM

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.