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HSB07-202009

CUI Devices

Manufacturer Part #:

HSB07-202009

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 20 X 20 X 9 MM

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Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.787" (20.00mm)
Length	0.787" (20.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.354" (9.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	24.08°C/W
Power Dissipation @ Temperature Rise	3.1W @ 75°C
Thermal Resistance @ Forced Air Flow	8.60°C/W @ 200 LFM

User Guide

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.