HSB07-202009

CUI Devices

Manufacturer Part #:

HSB07-202009

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 20 X 20 X 9 MM

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Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.787" (20.00mm)
Length	0.787" (20.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.354" (9.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	24.08°C/W
Power Dissipation @ Temperature Rise	3.1W @ 75°C
Thermal Resistance @ Forced Air Flow	8.60°C/W @ 200 LFM

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