HSB01-080808

CUI Devices

Manufacturer Part #:

HSB01-080808

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

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Specifications

Product Details

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.335" (8.50mm)
Length	0.335" (8.50mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.315" (8.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive (Not Included)
Thermal Resistance @ Natural	39.10°C/W
Power Dissipation @ Temperature Rise	1.9W @ 75°C
Thermal Resistance @ Forced Air Flow	16.00°C/W @ 200 LFM

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