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| 種別 | 製品説明 |
|---|---|
| カテゴリ | ICソケット |
| メーカー | Omron |
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 125°C |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Current Rating (Amps) | 1 A |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Termination | Solder |
| Mounting Type | Through Hole |
| Material Flammability Rating | UL94 V-0 |
| Product Status | Obsolete |
| Number of Positions or Pins (Grid) | 32 (1 x 32) |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Series | XR2 |
| Type | SIP |
| Contact Finish - Post | Gold |
| Mfr | Omron Electronics Inc-EMC Div |
| Pitch - Mating | 0.100" (2.54mm) |
| Termination Post Length | - |
| Features | Closed Frame |
| Contact Material - Mating | Beryllium Copper |
| Contact Resistance | 20mOhm |
| Package | Bulk |