Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	HSE-B18317-035H-01 CUI Devices Price: - RFQ	HSE-B18317-035H-01 CUI Devices	HEAT SINK, EXTRUSION, TO-218, 31	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18508-060H-W CUI Devices Price: - RFQ	HSE-B18508-060H-W CUI Devices	HEAT SINK, EXTRUSION,TO-218, 50.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18635-060H-W CUI Devices Price: - RFQ	HSE-B18635-060H-W CUI Devices	HEAT SINK, EXTRUSION, TO-218, 63	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	SF100-414505 CUI Devices Price: - RFQ	SF100-414505 CUI Devices	THERM PAD 41X45MM BLUE 1SHT=45PC	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP115035335 CUI Devices Price: - RFQ	CP115035335 CUI Devices	PELTIER, 50 X 35 X 3.35 MM, 11 A	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP70137 CUI Devices Price: - RFQ	CP70137 CUI Devices	PELTIER, 15 X 15 X 3.8 MM, 7 A,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB07-202009 CUI Devices Price: - RFQ	HSB07-202009 CUI Devices	HEAT SINK, BGA, 20 X 20 X 9 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB12-272706 CUI Devices Price: - RFQ	HSB12-272706 CUI Devices	HEAT SINK, BGA, 27 X 27 X 6 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	VHS-95 CUI Devices Price: - RFQ	VHS-95 CUI Devices	HEATSINK HALF BRICK ALUM BLACK	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: