Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	HSE-B2111-038 CUI Devices Price: - RFQ	HSE-B2111-038 CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B508-045H CUI Devices Price: - RFQ	HSE-B508-045H CUI Devices	HEAT SINK, EXTRUSION, TO-220, 50	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB09-212115 CUI Devices Price: - RFQ	HSB09-212115 CUI Devices	HEAT SINK, BGA, 21 X 21 X 15 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB10-232306 CUI Devices Price: - RFQ	HSB10-232306 CUI Devices	HEAT SINK, BGA, 23 X 23 X 6 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB21-454515 CUI Devices Price: - RFQ	HSB21-454515 CUI Devices	HEAT SINK, BGA, 45 X 45 X 15 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB23-232325 CUI Devices Price: - RFQ	HSB23-232325 CUI Devices	HEAT SINK, BGA, 23 X 23 X 25 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB28-606022 CUI Devices Price: - RFQ	HSB28-606022 CUI Devices	HEAT SINK, BGA, 60 X 60 X 22 MM,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-065V-02 CUI Devices Price: - RFQ	HSS-B20-065V-02 CUI Devices	HEATSINK TO-220 2.9W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-NP-03 CUI Devices Price: - RFQ	HSS-B20-NP-03 CUI Devices	HEATSINK TO-220 3.6W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-NP-06 CUI Devices Price: - RFQ	HSS-B20-NP-06 CUI Devices	HEATSINK TO-220 2.9W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: