Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	HSB20-353525 CUI Devices Price: - RFQ	HSB20-353525 CUI Devices	HEAT SINK, BGA, 35 X 35 X 25 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB22-606010 CUI Devices Price: - RFQ	HSB22-606010 CUI Devices	HEAT SINK, BGA, 60 X 60 X 10 MM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB25-282810 CUI Devices Price: - RFQ	HSB25-282810 CUI Devices	HEAT SINK, BGA, 28.5 X 28.5 X 10	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSB26-343408 CUI Devices Price: - RFQ	HSB26-343408 CUI Devices	HEAT SINK, BGA, 33.5 X 33.5 X 8	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-01 CUI Devices Price: - RFQ	HSC-01 CUI Devices	HEAT SINK CLIP FOR HSE-B18X-035H	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE12-B20-NP CUI Devices Price: - RFQ	HSE12-B20-NP CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-061H-01 CUI Devices Price: - RFQ	HSS-B20-061H-01 CUI Devices	HEATSINK TO-220 2.3W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-061H-02 CUI Devices Price: - RFQ	HSS-B20-061H-02 CUI Devices	HEATSINK TO-220 2.9W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-0508H-01S CUI Devices Price: - RFQ	HSS-B20-0508H-01S CUI Devices	HEATSINK TO-220 4.7W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B20254-056H CUI Devices Price: - RFQ	HSE-B20254-056H CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: