TSX713

EDSYN INCORPORATED

Manufacturer Part #:

TSX713

Manufacturer:

EDSYN INCORPORATED

Package:

Datasheet:

Description:

REFLOW VACUUM TIP, HOLE DIA: 1.3

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Specifications

Product Details

Mfr	EDSYN INCORPORATED
Width	-
Height	-
Length	0.551" (14.00mm)
Series	SOLDAVAC®
Package	Bag
Diameter	0.051" (1.30mm)
Tip Type	Rework
Tip Shape	Nozzle
Tip Chip Size	-
Product Status	Active
Temperature Range	-
For Use With/Related Products	-

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