SPC5777CSK3MMO4

NXP USA Inc.

Manufacturer Part #:

SPC5777CSK3MMO4

Manufacturer:

NXP USA Inc.

Package:

516-MAPBGA (27x27)

Datasheet:

Description:

POWER ARCH CORES, 8MB FLASH, 300

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Specifications

Product Details

Mfr	NXP USA Inc.
Speed	300MHz
Series	Automotive, AEC-Q100 MPC57xx
Package	Tray
RAM Size	512K x 8
Core Size	32-Bit Tri-Core
EEPROM Size	-
Peripherals	DMA, LVD, POR, Zipwire
Connectivity	CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Mounting Type	Surface Mount
Core Processor	e200z7
Package / Case	516-BGA
Product Status	Active
Data Converters	A/D 10x16b Sigma-Delta, eQADC
Oscillator Type	External, Internal
Program Memory Size	8MB (8M x 8)
Program Memory Type	FLASH
Operating Temperature	-40°C ~ 125°C (TA)
Supplier Device Package	516-MAPBGA (27x27)
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V

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