SPC5775BSK3MME2

NXP USA Inc.

Manufacturer Part #:

SPC5775BSK3MME2

Manufacturer:

NXP USA Inc.

Package:

416-MAPBGA (27x27)

Datasheet:

Description:

NXP 32-BIT MCU, 4MB FLASH FCACS

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Specifications

Product Details

Mfr	NXP USA Inc.
Speed	220MHz
Series	MPC57xx
Package	Tray
RAM Size	512K x 8
Core Size	32-Bit Dual-Core
EEPROM Size	-
Peripherals	DMA, LVD, POR
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Mounting Type	Surface Mount
Core Processor	e200z7
Package / Case	416-BGA
Product Status	Active
Data Converters	-
Oscillator Type	External
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
Operating Temperature	-40°C ~ 125°C (TA)
Supplier Device Package	416-MAPBGA (27x27)
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V

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