SIDC110D170HX1SA2

Infineon Technologies

Manufacturer Part #:

SIDC110D170HX1SA2

Manufacturer:

Infineon Technologies

Package:

Sawn on foil

Datasheet:

Description:

DIODE GP 1.7KV 200A WAFER

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Specifications

Product Details

Mfr	Infineon Technologies
Speed	Standard Recovery >500ns, > 200mA (Io)
Series	-
Package	Bulk
Technology	Standard
Mounting Type	Surface Mount
Package / Case	Die
Product Status	Discontinued at Digi-Key
Base Product Number	SIDC110D
Capacitance @ Vr, F	-
Supplier Device Package	Sawn on foil
Current - Reverse Leakage @ Vr	27 µA @ 1700 V
Voltage - DC Reverse (Vr) (Max)	1700 V
Current - Average Rectified (Io)	200A
Operating Temperature - Junction	-55°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If	1.8 V @ 200 A

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