Epson Electronics America Inc-Semiconductor Div S1C17W15F005100-160

Manufacturer Part #:

S1C17W15F005100-160

Manufacturer:

Epson Electronics America Inc-Semiconductor Div

Package/Case:

Die

Datasheet:

Description:

IC MCU 16BIT 64KB FLASH DIE

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Specifications

Type	Description
Category	Microcontrollers
Manufacturer	Epson Electronics America Inc-Semiconductor Div
Package/Case	Die
Core Processor	S1C17
DigiKey Programmable	Not Verified
Speed	4.2MHz
Operating Temperature	-40°C ~ 85°C (TA)
Program Memory Type	FLASH
RAM Size	4K x 8
Number of I/O	32
Peripherals	LCD, POR, PWM, RFC, SNDA, WDT
Mounting Type	Surface Mount
Product Status	Active
Oscillator Type	Internal
Supplier Device Package	Die
EEPROM Size	-
Series	-
Package / Case	Die
Core Size	16-Bit
Mfr	Epson Electronics America Inc-Semiconductor Div
Connectivity	I²C, IrDA, SPI, UART/USART
Program Memory Size	64KB (64K x 8)
Data Converters	-
Package	Tray
Voltage - Supply (Vcc/Vdd)	1.2V ~ 3.6V
Base Product Number	S1C17W15