MC33PF8200CLES

NXP USA Inc.

Manufacturer Part #:

MC33PF8200CLES

Manufacturer:

NXP USA Inc.

Package:

56-HVQFN (8x8)

Datasheet:

Description:

IC POWER MANAGEMENT

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Specifications

Product Details

Mfr	NXP USA Inc.
Series	-
Package	Tray
Applications	High Performance i.MX 8, S32x Processor Based
Mounting Type	Surface Mount, Wettable Flank
Package / Case	56-VFQFN Exposed Pad
Product Status	Obsolete
Current - Supply	-
Voltage - Supply	2.5V ~ 5.5V
Base Product Number	MC33PF8200
Operating Temperature	-40°C ~ 105°C (TA)
Supplier Device Package	56-HVQFN (8x8)

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Supply Information

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