IW-HSKALU-CLASLR-CU03

iWave Systems

Manufacturer Part #:

Manufacturer:

iWave Systems

Package:

Datasheet:

Description:

ZU+ MPSOC SOM MODULE HEATSINK

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Specifications

Product Details

Mfr	iWave Systems
Type	Top Mount
Shape	Rectangular, Fins
Width	2.953" (75.00mm)
Length	3.740" (95.00mm)
Series	-
Package	Bulk
Diameter	-
Material	Aluminum
Fin Height	1.181" (30.00mm)
Package Cooled	FPGA
Product Status	Active
Material Finish	-
Attachment Method	Bolt On
Thermal Resistance @ Natural	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-

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