HSS11-B20-P38

CUI Devices

Manufacturer Part #:

HSS11-B20-P38

Manufacturer:

CUI Devices

Package:

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 50.

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Specifications

Product Details

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular
Width	1.260" (32.00mm)
Length	2.000" (50.80mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.500" (12.70mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Thermal Resistance @ Natural	15.76°C/W
Power Dissipation @ Temperature Rise	4.8W @ 75°C
Thermal Resistance @ Forced Air Flow	6.90°C/W @ 200 LFM

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