HPC 252010BMV-3R3M

TAI-TECH Advanced Electronics Co., Ltd.

Manufacturer Part #:

HPC 252010BMV-3R3M

Manufacturer:

TAI-TECH Advanced Electronics Co., Ltd.

Package:

1008

Datasheet:

Description:

3.3 UH SHIELDED DRUM CORE, WIREW

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Specifications

Product Details

Mfr	TAI-TECH Advanced Electronics Co., Ltd.
Type	Wirewound
Series	-
Package	Tape & Reel (TR)
Ratings	AEC-Q200
Features	-
Q @ Freq	-
Shielding	Shielded
Tolerance	±20%
Inductance	3.3 µH
Mounting Type	Surface Mount
Package / Case	1008 (2520 Metric)
Product Status	Active
Material - Core	-
Size / Dimension	0.098" L x 0.079" W (2.50mm x 2.00mm)
DC Resistance (DCR)	204mOhm Max
Current Rating (Amps)	1.7 A
Height - Seated (Max)	0.039" (1.00mm)
Operating Temperature	-55°C ~ 125°C
Supplier Device Package	1008
Frequency - Self Resonant	-
Current - Saturation (Isat)	1.3A

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