BDN09-3CB

CTS Corporation

Manufacturer Part #:

BDN09-3CB

Manufacturer:

CTS Corporation

Package:

Datasheet:

Description:

HEATSINK CPU .91" SQ

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Specifications

Product Details

Mfr	CTS Thermal Management Products
Type	Top Mount
Shape	Square, Pin Fins
Width	0.910" (23.11mm)
Length	0.910" (23.11mm)
Series	BDN
Package	Box
Diameter	-
Material	Aluminum
Fin Height	0.355" (9.02mm)
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Not Included)
Base Product Number	BDN09
Thermal Resistance @ Natural	26.90°C/W
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	9.60°C/W @ 400 LFM

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