Thermal - SemiKey

Thermal (469)

Clear All

Image	Part #	Description	Availability	Pricing (USD)	Qty.
	HSE02-173213 CUI Devices Price: - RFQ	HSE02-173213 CUI Devices	HEAT SINK, EXTRUSION, 17 X 31.9	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE04-251265-2 CUI Devices Price: - RFQ	HSE04-251265-2 CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-0508H-01R CUI Devices Price: - RFQ	HSS-B20-0508H-01R CUI Devices	HEATSINK TO-220 4.7W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-0452H CUI Devices Price: - RFQ	HSS-B20-0452H CUI Devices	HEATSINK TO-220 3.2W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-061H-03 CUI Devices Price: - RFQ	HSS-B20-061H-03 CUI Devices	HEATSINK TO-220 2.9W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-NP-12 CUI Devices Price: - RFQ	HSS-B20-NP-12 CUI Devices	HEATSINK TO-220 6.8W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS06-C20-P32 CUI Devices Price: - RFQ	HSS06-C20-P32 CUI Devices	HEAT SINK, STAMPING, TO-220, 27.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B20270-040H CUI Devices Price: - RFQ	HSE-B20270-040H CUI Devices	HEAT SINK, EXTRUSION, TO-220, 27	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B20508-035H-01 CUI Devices Price: - RFQ	HSE-B20508-035H-01 CUI Devices	HEAT SINK, EXTRUSION, TO-220, 50	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	SF100-153005 CUI Devices Price: - RFQ	SF100-153005 CUI Devices	THERM PAD 15MMX30MM 1 SHT=196 PC	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: