Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	CP105433H CUI Devices Price: - RFQ	CP105433H CUI Devices	PELTIER, 40 X 40 X 3.3 MM, 10.5	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	SF500G-204005 CUI Devices Price: - RFQ	SF500G-204005 CUI Devices	THERM PAD 20MMX40MM BLUE	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-05 CUI Devices Price: - RFQ	HSC-05 CUI Devices	HEAT SINK CLIP FOR HSS01-B20-CP	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-07 CUI Devices Price: - RFQ	HSC-07 CUI Devices	HEAT SINK CLIP FOR HSE06-503045,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18254-035H-00 CUI Devices Price: - RFQ	HSE-B18254-035H-00 CUI Devices	HEAT SINK, EXTRUSION, TO-218, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18318-0396H CUI Devices Price: - RFQ	HSE-B18318-0396H CUI Devices	HEAT SINK, EXTRUSION,TO-218, 31.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18635-0396H CUI Devices Price: - RFQ	HSE-B18635-0396H CUI Devices	HEAT SINK, EXTRUSION, TO-218, 63	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B20250-040H-01 CUI Devices Price: - RFQ	HSE-B20250-040H-01 CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	AF200-204005 CUI Devices Price: - RFQ	AF200-204005 CUI Devices	THERM PAD 20MMX40MM WHT	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	AF200-303005 CUI Devices Price: - RFQ	AF200-303005 CUI Devices	THERM PAD 30MMX30MM WHT	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: