Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	HSC-06 CUI Devices Price: - RFQ	HSC-06 CUI Devices	HEAT SINK CLIP FOR HSS08-B18-CP	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-11 CUI Devices Price: - RFQ	HSC-11 CUI Devices	HEAT SINK CLIP FOR STAMPED/EXTRU	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-08 CUI Devices Price: - RFQ	HSC-08 CUI Devices	HEAT SINK CLIP FOR HSE06-503045,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18254-035H CUI Devices Price: - RFQ	HSE-B18254-035H CUI Devices	HEAT SINK, EXTRUSION, TO-218, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18317-035H CUI Devices Price: - RFQ	HSE-B18317-035H CUI Devices	HEAT SINK, EXTRUSION, TO-218, 31	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18508-0396H CUI Devices Price: - RFQ	HSE-B18508-0396H CUI Devices	HEAT SINK, EXTRUSION, TO-218, 50	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	AF500-153005 CUI Devices Price: - RFQ	AF500-153005 CUI Devices	THERM PAD 15MMX30MM 1 SHEET=92PC	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	AF100-707005 CUI Devices Price: - RFQ	AF100-707005 CUI Devices	THERM PAD 70X70MM 1 SHEET OF 18	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	AF200-101005 CUI Devices Price: - RFQ	AF200-101005 CUI Devices	THERM PAD 10MMX10MM WHT	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP30239H CUI Devices Price: - RFQ	CP30239H CUI Devices	PELTIER, 20 X 20 X 3.9 MM, 3.0 A	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: