Thermal - SemiKey

Thermal (469)

Clear All

Image	Part #	Description	Availability	Pricing (USD)	Qty.
	CP603395H CUI Devices Price: - RFQ	CP603395H CUI Devices	PELTIER, 30 X 30 X 3.95 MM, 6 A,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP074965-238P CUI Devices Price: - RFQ	CP074965-238P CUI Devices	PELTIER, 4.9 X 6.5 X 2.77 MM, 0.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP404046 CUI Devices Price: - RFQ	CP404046 CUI Devices	PELTIER, 40 X 40 X 4.6, 4 A, WIR	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP40447 CUI Devices Price: - RFQ	CP40447 CUI Devices	PELTIER, 40 X 40 X 4.7 MM, 4 A,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP455535H CUI Devices Price: - RFQ	CP455535H CUI Devices	PELTIER, 50 X 50 X 5.35 MM, 4.5	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP10205033 CUI Devices Price: - RFQ	CP10205033 CUI Devices	PELTIER, 20 X 50 X 3.3 MM, 10 A,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS01-B20-CP CUI Devices Price: - RFQ	HSS01-B20-CP CUI Devices	HEAT SINK, STAMPING, TO-220, 49.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B20635-035H-W CUI Devices Price: - RFQ	HSE-B20635-035H-W CUI Devices	HEAT SINK, EXTRUSION, TO-220, 63	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B250-04H CUI Devices Price: - RFQ	HSE-B250-04H CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B381-04H CUI Devices Price: - RFQ	HSE-B381-04H CUI Devices	HEAT SINK, EXTRUSION, TO-220/TO-	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: