Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	HSE-B18508-035H CUI Devices Price: - RFQ	HSE-B18508-035H CUI Devices	HEAT SINK, EXTRUSION, TO-218, 50	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18635-035H-04 CUI Devices Price: - RFQ	HSE-B18635-035H-04 CUI Devices	HEAT SINK, EXTRUSION, TO-218, 63	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18381-0396H CUI Devices Price: - RFQ	HSE-B18381-0396H CUI Devices	HEAT SINK, EXTRUSION, TO-218, 38	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18635-035H CUI Devices Price: - RFQ	HSE-B18635-035H CUI Devices	HEAT SINK, EXTRUSION,TO-218, 63.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B20250-040H CUI Devices Price: - RFQ	HSE-B20250-040H CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B20254-035H-01 CUI Devices Price: - RFQ	HSE-B20254-035H-01 CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	CP603315H CUI Devices Price: - RFQ	CP603315H CUI Devices	PELTIER, 30 X 30 X 3.15 MM, 6 A,	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-NP-07 CUI Devices Price: - RFQ	HSS-B20-NP-07 CUI Devices	HEATSINK TO-220 2.3W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSS-B20-NP-11 CUI Devices Price: - RFQ	HSS-B20-NP-11 CUI Devices	HEATSINK TO-220 4.4W ALUMINUM	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	AF500-265005 CUI Devices Price: - RFQ	AF500-265005 CUI Devices	THERM PAD 26MMX50MM WHT 1SH=64PC	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: