Thermal - SemiKey

Thermal (469)

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Image	Part #	Description	Availability	Pricing (USD)	Qty.
	SF500-301205 CUI Devices Price: - RFQ	SF500-301205 CUI Devices	THERM PAD 30MMX12MM BLUE	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	SF400-505005 CUI Devices Price: - RFQ	SF400-505005 CUI Devices	THERM PAD 50MMX50MM 1 SHEET=32PC	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	SF400-414505 CUI Devices Price: - RFQ	SF400-414505 CUI Devices	THERM PAD 41X45MM GRAY 1SHT=45PC	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	SF500-303005 CUI Devices Price: - RFQ	SF500-303005 CUI Devices	THERM PAD 30MMX30MM BLUE	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-09 CUI Devices Price: - RFQ	HSC-09 CUI Devices	HEAT SINK CLIP FOR STAMPED/EXTRU	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSC-10 CUI Devices Price: - RFQ	HSC-10 CUI Devices	HEAT SINK CLIP FOR STAMPED/EXTRU	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B1711-032 CUI Devices Price: - RFQ	HSE-B1711-032 CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B1711-057 CUI Devices Price: - RFQ	HSE-B1711-057 CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18254-0396H CUI Devices Price: - RFQ	HSE-B18254-0396H CUI Devices	HEAT SINK, EXTRUSION,TO-218, 25.	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ:
	HSE-B18381-060H-W CUI Devices Price: - RFQ	HSE-B18381-060H-W CUI Devices	HEAT SINK, EXTRUSION, TO-218, 38	Supplier Type: In Stock: RFQ Stock Location: - Date Code: - Lead Time: -	-	MOQ: SPQ: